GConferenceGridThe Conference Catalogue · Vol. 2026Folio № 66ABC3
Of the Field

DAC 2026

T

he Design Automation Conference (DAC) is a premier event in the fields of electronic design automation (EDA), embedded systems, AI, security, and system design. Bringing together industry leaders, academic experts, and the world’s most innovative companies, DAC 2026 features technical sessions, keynote speakers, and an exhibition showcasing the latest advan…

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12Voices
15Underwriters
0Exhibitors
0On the bill · sessions
25Companies · in total
§I

The Voices

Programmed at DAC, in alphabetical order.
Amit Gupta
Senior VP, EDA AI and Custom IC · Siemens DISW
Artour Levin
Corporate Vice President, AI Silicon Engineering · Microsoft
Dr. Baaziz Achour
EVP and Chief Technology Officer · Qualcomm Technologies, Inc.
Dr. Huiming Bu
Vice President, Global Semiconductors R&D and Albany Operations · IBM Research
Dylan Patel
Founder, CEO, and Chief Analyst · SemiAnalysis
Jan M. Rabaey
Professor Emeritus · University of California at Berkeley
Jay Vleeschhouwer
Managing Director · Griffin Securities
Jeffrey Z. Pan
Co-Founder and CTO · Bronco AI
John Martinis
CTO & Co-Founder Qolab and 2025 Nobel Laureate in Physics · Qolab
Lalitha Immaneni
Vice President, Semiconductor Research & Development, APTM · Intel
Timothy Costa
General Manager and Vice President of Computational Engineering · NVIDIA
William Wang
CEO and Founder · ChipAgents.ai
§II

Underwritten By

The houses behind the program. Tiers as disclosed.
Bronco AIPlatinum
ChipAgents.aiPlatinum
NormalPlatinum
SiemensPlatinum
AgentrysSilver
CadenceSilver
KeysightSilver
RicursiveSilver
SynopsysSilver
Amazon Kuiper SystemsBronze
VerifaixBronze
ACM SIGDAConference Sponsor
IEEEConference Sponsor
IEEE Council on Electronic Design AutomationConference Sponsor
IEEE Solid-State Circuits SocietyTechnical Conference Sponsor
Intermission
Part the Second · For the Buyer

What does it mean when 25 companies show up — and 2 bet on three roles at once?

“25 companies. two are betting more than once.”

The numbers below are derived from the speakers, sponsors, and exhibitors on this page — cross-referenced into one ledger. They are the only thing here that 10times.com cannot tell you.

№ 01Fig. 01 — Composition of the House
2All threespeak · spons · exh
13Sponsoringsponsor only
0Exhibitingexhibitor only
10Speakingspeaker only

The Triple-Threat

Bronco AI·ChipAgents.ai

№ 02Fig. 02 — The Voices, by Seniority

92% of the speakers carry senior titles — C-suite, Founder, VP, or Director-level.

  • C-suite542%
  • VP-level542%
  • Director / Head of18%
  • Other roles18%

Of 12 on the bill · classified by free-text title

№ 03Fig. 03 — The Heaviest in the Room
  1. 01Bronco AISp·P1V
  2. 02ChipAgents.aiSp·P1V
  3. 03ACM SIGDASp·C
  4. 04AgentrysSp·S
  5. 05Amazon Kuiper SystemsSp·B
  6. 06CadenceSp·S
  7. 07IEEESp·C
  8. 08IEEE Council on Electronic Design AutomationSp·C
  9. 09IEEE Solid-State Circuits SocietySp·T
  10. 10KeysightSp·S
  11. 11NormalSp·P
  12. 12RicursiveSp·S
  13. 13SiemensSp·P
  14. 14SynopsysSp·S
№ 04Fig. 04 — By Tier
platinum4
27% of 15
silver5
33% of 15
bronze2
13% of 15
conference sponsor3
20% of 15
technical conference sponsor1
7% of 15